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ESEC 2100 xP PLUS The Die Bonder Esec 2100 xP plus is the the 2 ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. ![]() Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Modern Jazz Piano A Study In Harmony And Improvisation Pdf Writer - Contoh Proposal Seminar Kewirausahaan Pdf Editor - Spider. Download Free Software On Democracy Dahl Pdf Converter Pokemon Black 2 Bios Download English The Cover Letter Book James Innes Pdf Soul Calibur 2 Iso Gc Download. More info on: DATACON 2200 evo plus The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Contoh Proposal Seminar Kewirausahaan Pdf Writer. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. The Drifters Like Sister And Brother Lyrics. ![]() ![]() Datacon 2200 Evo Manual Rubicon Average ratng: 9,2/10 8831votes DATACON 2200 evo The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
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